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Ultra Low-Power Electronics and Design by E. Macii PDF

By E. Macii

ISBN-10: 1402080751

ISBN-13: 9781402080753

Energy intake is a key predicament in lots of high-speed and high-data-rate digital structures this present day, starting from cellular telecom to transportable and machine computing platforms, specifically whilst relocating to nanometer applied sciences. Ultra Low-Power Electronics and layout bargains to the reader the original chance of getting access to in a simple and built-in type a mixture of educational fabric and complicated learn effects, contributed by means of prime scientists from academia and undefined, masking the main sizzling and up to date concerns within the box of the layout of extremely low-power units, platforms and functions.

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Ootaguro, T. Kuroda, Utilizing Surplus Timing for Power Reduction, Proceedings IEEE Custom Integrated Circuits Conference CICC, 2001, pp. 89-92. [19] A. Srivastava, D. Sylvester, Minimizing Total Power by Simultaneous Vdd/Vth Assignment, Proceedings of the Asia and South Pacific Design Automation Conference 2003, pp. 400-403. [20] K. Usami, M. Horowitz, Clustered Voltage Scaling Technique for Low-Power Design, Proceedings of the International Symposium on Low Power Design ISLPD, 1995, pp. 38. TLFeBOOK 20 [21] K.

For an on-chip interconnect network, a BER of 10−15 is acceptable. 3. For the given BER and for the noise signal associated with the photodiode and transimpedance circuit the minimum optical power required by the receiver to operate at the given error probability can be calculated using the Morikuni formula [12]. With this figure, and knowing the layout and therefore the optical losses that will be incurred in the waveguides, the minimum required optical power at the source can be estimated. The total electrical power dissipated in the optical TLFeBOOK 30 link is the sum of the power dissipated by the number of optical receivers and the energy needed by the source to provide the required optical power.

7f, shows how technological advances are required to improve system performance, concerning in this case waveguide sidewall roughness. 6GHz and 20mm chip width. 3dB/cm, we obtain a power dissipation figure of about 10mW, a fiftyfold decrease in the overall power dissipation by going from 5nm roughness to 2nm roughness. This demonstrates the importance of optimising the passive waveguide technology for the whole system. 7a. 7b. 7c. 7d. 7e. 7f. 3dBm (at 3GHz). 2. 2. Optical power budget for 20mm die width at 3GHz Number of nodes in H-tree 16 32 64 128 Loss in straight lines (dB) Loss in curved lines (dB) Loss in Y-dividers (dB) Loss in Y-couplers (dB) Output coupling loss (dB) Input coupling loss (dB) Total optical loss (dB) Min.

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Ultra Low-Power Electronics and Design by E. Macii


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