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Extra info for More-than-Moore 2.5D and 3D SiP Integration

Sample text

Tiny Die Access Value Proposition: Advanced CMOS technologies, are expensive, and becoming more so—with costs per mm2 of Si increasing in every successive node. This is driven by increasing processes complexity, driving CapEx up, and the mask count heading toward 100 masks. However, power-performance constraints favor implementation of high performance digital circuitry in advanced technology nodes. Hence, given that Si is the principal portion of the cost of an IC, business considerations dictate the use of minimum die size possible.

15 mm Photo Defined Layer(s) PrePreg Build Up Layer(s) glass core ~ 10 0’s um Fig. 5D Integration, pushes the need for increased dimensional stability, and hence naturally favors higher glass content. , CTE) can be tailored within reason to specific applications, and with superior electrical insulation properties. In principle, it could be made at very low cost, potentially using roll-to-roll manufacturing. 0 m) sizes. 5D packages are different. i. LCIg Construction: Two basic approaches have been proposed, albeit neither has been demonstrated in full for multi-die SiP constructions: (a) Glass Core Substrate (Panel): with this approach glass sheets, rather than glass fiber weave embedded in resin, are used to form the core of the substrate, presumably resulting in a package with superior dimensional stability, and hence more compatible with fine line requirements.

5D SiP Technology Component Level Value Fig. 1 System Integration Value Proposition Typical representative SiP implementation scheme that demonstrates the ‘Better Integration’ value proposition, at its best, is the integration of high-end GPU processor with the High Bandwidth Memory (HBM), as implemented for example by AMD (Black 2012; Lee and Black et al. 2016). The principal value proposition is superior power-performance, provided by the High Bandwidth Memory, and Memory to Logic interconnect.

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